ADHESIVETAPE AND MANUFACTURE METHOD FOR PRODUCING QUAD-FLAT NON-LEAD SEMICONDUCTOR DEVICES

A method for preparing a polyimide silicone adhesive tape for producing a QFN(Quad-Flat Non-lead) semiconductor package is provided to minimize the thickness of an adhesive layer, to prevent dropping of an epoxy resin and separation or lift-up from a lead frame, and to leave no residue after removal...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JEON, HONG SEUNG, PARK, MEE YOUNG, LEE, TAE HO, JI, SANG BONG, AHN, CHI HEE
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A method for preparing a polyimide silicone adhesive tape for producing a QFN(Quad-Flat Non-lead) semiconductor package is provided to minimize the thickness of an adhesive layer, to prevent dropping of an epoxy resin and separation or lift-up from a lead frame, and to leave no residue after removal. A method for preparing a polyimide silicone adhesive tape attached to the bottom of a lead frame of a QFN(Quad-Flat Non-lead) semiconductor package to prevent dropping of an epoxy resin injected to the top of the lead frame, comprises the steps of: (i) treating a primer(200) for silicone on the top of a polyimide film(100); (ii) stacking a silicone adhesive layer(300) on the top of the polyimide film treated with a primer for silicone; and (iii) attaching a fluorine-containing release agent-treated polyethylene terephthalate film(400) on the top of the silicone adhesive layer.