OVERLAY VERNIER KEY AND THE METHOD FOR FABRICATING OVERLAY VERNIER

An overlay vernier key and a method for manufacturing the same are provided to improve the overlay accuracy of a laminated structure including an opaque layer by forming an overlay vernier using a fluorescent material. A semiconductor substrate(200) has a cell region and a scribe lane region. An out...

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Bibliographische Detailangaben
1. Verfasser:	CHO, BYEONG HO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	An overlay vernier key and a method for manufacturing the same are provided to improve the overlay accuracy of a laminated structure including an opaque layer by forming an overlay vernier using a fluorescent material. A semiconductor substrate(200) has a cell region and a scribe lane region. An outer box(210) is formed on the scribe region of the semiconductor substrate. A fluorescent layer(220) is formed on the semiconductor substrate including the outer box. A laminated structure(280) includes an opaque layer formed on the fluorescent layer. An inner box(300) is formed on the structure. The fluorescent layer is made of one or more groups consisting of a radiation material including blende(ZnS), a mixture of blende(ZnS) and cadmium sulfide(CdS), a compound of silver(Ag), copper(Cu), or lead(Pb) added to the mixture of the blende and the cadmium sulfide, and radium(Ra). The opaque layer includes a carbon-based layer or a poly silicon layer.