BALL MOUNTING APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGES

A ball mount apparatus for use in fabrication of a semiconductor package is provided to automatically align a center position of a bonding pad when a solder ball is seated on flux of the bonding pad. A strip(S) with plural bonding pads(P) is fixed to a carrier block(10), solder balls attached to the bonding pads. A flux head applies flux to each bonding pad of the carrier block. A flux heating unit(50) heats the flux applied to the strip of the carrier block to decrease viscosity of the flux. A ball mount head seats the solder ball on each bonding pad of the strip. Blast ducts(51,53) are installed over the transfer path of the carrier block, and the air blown by the blast ducts is heated by a heater(54) installed in the blast ducts.