FILM SUBSTRATE AND PRESSURE-SENSITIVE ADHESIVE TAPE

A film substrate having a satisfactory balance among properties including flexibility, suitability for tearing by hand, heat resistance, and wearing resistance; and a pressure-sensitive adhesive tape employing the film substrate. The film substrate is characterized by comprising 100 parts by mass of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	SAITA SEIJI, HASUMI MIZUKI, OOOKA SUSUMU
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A film substrate having a satisfactory balance among properties including flexibility, suitability for tearing by hand, heat resistance, and wearing resistance; and a pressure-sensitive adhesive tape employing the film substrate. The film substrate is characterized by comprising 100 parts by mass of an aromatic vinyl elastomer, 10-60 parts by mass of a styrene resin, and 1-50 parts by mass of a styrene copolymer having a Vicat softening point of 100-130°C. The pressure-sensitive adhesive tape comprises the film substrate and a pressure-sensitive adhesive layer formed on one side of the substrate.