LASER CUTTING SYSTEM AND METHOD FOR CUTTING A BRITTLE SUBSTRATE USING THE SAME

A laser cutting apparatus that can reduce cutting time, increase cutting speed, and improve productivity is provided, and a laser cutting method using the laser cutting apparatus is provided. A laser cutting apparatus(100) comprises: a first loading part(710) and a second loading part(720) which are installed relatively to each other, reciprocated along a first direction and a second direction perpendicular to the first direction, and used to load brittle substrates(101,102); a laser generator(300) positioned between the first and second loading parts to generate a laser beam; a first cooler(410) and a second cooler(420) which are positioned relatively at both sides of the laser generator along the first direction, and which spray a coolant; a first scriber(210) positioned relatively at one side of the laser generator of the second cooler along the first direction to form an estimated cutting line on a brittle substrate; and a second scriber(220) positioned relatively at one side of the laser generator of the first cooler along the first direction to form an estimated cutting line on a brittle substrate. The laser cutting apparatus further comprises a first linear track(610) and a second linear track(620) which are installed relatively to each other and positioned to extend along the second direction, and a third linear track(500) extending along the first direction, wherein the first and second linear tracks are capable of reciprocating along the first direction above the third linear track, and the first and second loading parts are capable of reciprocating along the second direction above the first and second linear tracks.