INERTIAL BONDING METHOD OF FORMING A SPUTTERING TARGET ASSEMBLY AND ASSEMBLY MADE THEREFROM

A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sp...

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Bibliographische Detailangaben
Hauptverfasser:	HAAG JASON, WICKERSHAM CHARLES E
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.