AN ADJUSTING UNIT AND BONDING MACHINE OF SUBSTRATES TO REDUCE VIBRATION

A vibration compensation unit and a substrate bonding device having the same are provided to detect the vibration generated in the process of bonding and to cancel the detected vibration. A vibration compensation unit(200) comprises a vibration quantity measurement part(210), a vibration analysis pa...

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Bibliographische Detailangaben
1. Verfasser:	PARK, CHAN SUK
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	A vibration compensation unit and a substrate bonding device having the same are provided to detect the vibration generated in the process of bonding and to cancel the detected vibration. A vibration compensation unit(200) comprises a vibration quantity measurement part(210), a vibration analysis part(220) and a vibration attenuation part(230). The vibration quantity measurement part measures the displacement of a stage, which is installed at a substrate bonding device, depending on time. The vibration analysis part analyzes the data acquired by the vibration quantity measurement part and calculates the average displacement rate. Using the calculated average displacement rate, the vibration attenuation part attenuates the vibration by shifting the stage.