ANISOTROPIC CONDUCTIVE FILM BONDING APPARATUS

An anisotropic conductive film bonding apparatus is provided to prevent a panel entering the apparatus from being damaged by broken glass or particles in a previous process. An anisotropic conductive film bonding apparatus includes a substrate stage(210) on which a substrate is mounted, a supply uni...

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Bibliographische Detailangaben
1. Verfasser: LEE, CHEOL HAENG
Format: Patent
Sprache:eng
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