ANISOTROPIC CONDUCTIVE FILM BONDING APPARATUS

An anisotropic conductive film bonding apparatus is provided to prevent a panel entering the apparatus from being damaged by broken glass or particles in a previous process. An anisotropic conductive film bonding apparatus includes a substrate stage(210) on which a substrate is mounted, a supply uni...

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Bibliographische Detailangaben
1. Verfasser:	LEE, CHEOL HAENG
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FREQUENCY-CHANGING INSULATORS NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SEMICONDUCTOR DEVICES TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	An anisotropic conductive film bonding apparatus is provided to prevent a panel entering the apparatus from being damaged by broken glass or particles in a previous process. An anisotropic conductive film bonding apparatus includes a substrate stage(210) on which a substrate is mounted, a supply unit(100), a carrier(500), and a cleaning member(400). The supply unit supplies an anisotropic conductive film(130) to the substrate stage. The carrier transfers the anisotropic conductive film from the supply unit to the substrate stage. The cleaning member cleans the substrate stage. The cleaning member is a brush.