RESIN COMPOSITION, SHEET-LIKE FORMED BODY, PREPREG, CURED BODY, LAMINATE, AND MULTILAYER LAMINATE

RESIN COMPOSITION, SHEET-LIKE FORMED BODY, PREPREG, CURED BODY, LAMINATE, AND MULTILAYER LAMINATE

Disclosed is a resin composition containing an epoxy resin and an inorganic filler, particularly a resin composition which is improved in adhesion or cohesion between a cured product thereof and a second layer when the second layer is formed on the surface of the cured product. Also disclosed are a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KOBAYASHI TAKAYUKI, GOTO NOBUHIRO, HEISHI MASARU, KOUYANAGI HIROSHI
Format: Patent
Sprache:eng
Schlagworte:
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
GENERAL PROCESSES OF COMPOUNDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
WORKING-UP
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Beschreibung
Zusammenfassung:Disclosed is a resin composition containing an epoxy resin and an inorganic filler, particularly a resin composition which is improved in adhesion or cohesion between a cured product thereof and a second layer when the second layer is formed on the surface of the cured product. Also disclosed are a prepreg using such a resin composition, a cured body, a sheet-like formed body, a laminate and a multilayer laminate. Specifically disclosed is a resin composition containing an epoxy resin, a curing agent for epoxy resins, and a silica which is treated with an imidazole silane and has an average particle diameter of not more than 5 mum. This resin composition contains 0.1-80 parts by weight of the silica per 100 parts by weight of a mixture composed of the epoxy resin and the curing agent for epoxy resins.