METHOD AND DEVICE FOR APPLYING HARD SOLDER

The invention relates to a device and a method for applying hard solder (1) to an at least partially structured metal foil (2), comprising at least the following steps: a) provision of at least one flat metal foil (2), b) shaping of the at least one metal foil (2) so that a structure (3) is produced...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	WIERES LUDWIG
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The invention relates to a device and a method for applying hard solder (1) to an at least partially structured metal foil (2), comprising at least the following steps: a) provision of at least one flat metal foil (2), b) shaping of the at least one metal foil (2) so that a structure (3) is produced, c) application of hard solder (1) to the at least one metal foil (2), the steps b) and c) being carried out discontinuously and at least partially together. The invention is preferably applied in the manufacture of metal honeycomb bodies for the treatment of exhaust gases in vehicles.