FLANGED TRANSDUCER HAVING IMPROVED RIGIDITY
A transducer of which rigidity has been increased to reduce deflection of a tip of the transducer during bonding to avoid disadvantages of transducers of the prior art is provided. A transducer(10) comprises: a horn(12) constructed to transmit vibrations along its length during operation in the form...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | A transducer of which rigidity has been increased to reduce deflection of a tip of the transducer during bonding to avoid disadvantages of transducers of the prior art is provided. A transducer(10) comprises: a horn(12) constructed to transmit vibrations along its length during operation in the form of an oscillatory waveform having a plurality of vibration nodal points; an ultrasonic generator(20) connected to one end of the horn, and a bonding tool connected to the other end of the horn to perform a bonding operation; a first flange structure(22) disposed along the length of the horn at a first vibration nodal point to mount the transducer; a second flange structure(24) disposed along the length of the horn at a second vibration nodal point to mount the transducer, the second flange structure being separated from the first flange structure as long as a distance between at least two consecutive vibration nodal points. The flange structures comprise neck portions(26,26') projecting from the horn at the vibration nodal points and mounting portions connected to the neck portions, the mounting portions including devices(28,28') for attaching the transducer to a bonding machine. The transducer comprises a long shoulder portion(30) that is formed between the mounting portion and the neck portion, and extends substantially parallel to a longitudinal axis line of the horn. The second flange structure is spaced from the first flange structure as long as one wavelength. The bonding tool is a capillary(16). |
---|