ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE

Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains (A) a high- molecular-weight component containing a functional...

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Bibliographische Detailangaben
Hauptverfasser: INADA TEIICHI, OOKUBO KEISUKE
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Disclosed is an adhesive bonding sheet comprising a light-transmitting supporting base and an adhesive bonding layer which can be used in both the dicing step and the semiconductor device bonding step. The adhesive bonding layer contains (A) a high- molecular-weight component containing a functional group which has a weight average molecular weight of not less than 100,000; (B) an epoxy resin; (C) a phenol epoxy resin curing agent; (D) a photoreactive monomer whose cured product obtained by being irradiated with ultraviolet light has a Tg of not less than 250°C; and (E) a photoinitiator which generates bases and radicals when irradiated with ultraviolet light having a wavelength of 200-450 nm.