PROCESS FOR PROTECTING PATINATED SURFACE OF COPPER PRODUCT AND PATINATED COPPER PRODUCT

A method for protecting a patina surface of a copper product and a patina-treated copper product are provided to prevent the copper product from being eroded by preventing the patina dust from being generated from the copper product. A method for protecting a patina surface of a copper product compr...

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Bibliographische Detailangaben
1. Verfasser:	HOVELING STEFAN
Format:	Patent
Sprache:	eng
Schlagworte:	APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ATOMISING APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY NOZZLES PERFORMING OPERATIONS SPRAYING APPARATUS SPRAYING OR ATOMISING IN GENERAL SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for protecting a patina surface of a copper product and a patina-treated copper product are provided to prevent the copper product from being eroded by preventing the patina dust from being generated from the copper product. A method for protecting a patina surface of a copper product comprises the steps of providing an aqueous polymer solution onto a patina-surface of the copper product such that the aqueous polymer solution penetrates into a surface of a porous patina, and drying the aqueous polymer solution such that the aqueous polymer solution forms a vapor diffusion permeable membrane together with the patina. An amount of the aqueous polymer solution, which is provided onto the patina surface of the copper product, is 5-10 g/m^2. The aqueous polymer solution is provided onto the patina surface of the copper product in the form of droplets.