CERAMIC MEMBER, CERAMIC HEATER, SUBSTRATE PLACING MECHANISM, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING CERAMIC MEMBER
A wafer placing table (11) constituted as a ceramic heater has a power feeding section (14) for a heat generating body (13) and a bonding section (16) to a supporting member (12) as portions which can be break starting points. The wafer placing table is constituted to permit compressive stress to be...
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creator | HANADA YOSHIYUKI |
description | A wafer placing table (11) constituted as a ceramic heater has a power feeding section (14) for a heat generating body (13) and a bonding section (16) to a supporting member (12) as portions which can be break starting points. The wafer placing table is constituted to permit compressive stress to be generated in the power feeding terminal section (14) and/or the bonding section (16) which can be the break starting points. |
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The wafer placing table is constituted to permit compressive stress to be generated in the power feeding terminal section (14) and/or the bonding section (16) which can be the break starting points.</description><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; METALLURGY ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; TREATMENT OF NATURAL STONE</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080430&DB=EPODOC&CC=KR&NR=20080037682A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080430&DB=EPODOC&CC=KR&NR=20080037682A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANADA YOSHIYUKI</creatorcontrib><title>CERAMIC MEMBER, CERAMIC HEATER, SUBSTRATE PLACING MECHANISM, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING CERAMIC MEMBER</title><description>A wafer placing table (11) constituted as a ceramic heater has a power feeding section (14) for a heat generating body (13) and a bonding section (16) to a supporting member (12) as portions which can be break starting points. 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The wafer placing table is constituted to permit compressive stress to be generated in the power feeding terminal section (14) and/or the bonding section (16) which can be the break starting points.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE |
title | CERAMIC MEMBER, CERAMIC HEATER, SUBSTRATE PLACING MECHANISM, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING CERAMIC MEMBER |
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