CERAMIC MEMBER, CERAMIC HEATER, SUBSTRATE PLACING MECHANISM, SUBSTRATE PROCESSING APPARATUS AND METHOD FOR MANUFACTURING CERAMIC MEMBER

A wafer placing table (11) constituted as a ceramic heater has a power feeding section (14) for a heat generating body (13) and a bonding section (16) to a supporting member (12) as portions which can be break starting points. The wafer placing table is constituted to permit compressive stress to be...

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Bibliographische Detailangaben
1. Verfasser:	HANADA YOSHIYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA METALLURGY REFRACTORIES SEMICONDUCTOR DEVICES SLAG TREATMENT OF NATURAL STONE
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Beschreibung
Zusammenfassung:	A wafer placing table (11) constituted as a ceramic heater has a power feeding section (14) for a heat generating body (13) and a bonding section (16) to a supporting member (12) as portions which can be break starting points. The wafer placing table is constituted to permit compressive stress to be generated in the power feeding terminal section (14) and/or the bonding section (16) which can be the break starting points.