APPARATUS FOR DEPOSITING THIN FILM AND METHOD OF DEPOSITING THE SAME

An apparatus and a method for depositing a thin film are provide to obtain a thin film having a uniform thickness by preventing impurities from being formed in a nozzle tube that supplies processing gas. An apparatus for depositing a thin film comprises a chamber(10) having an internal space defined...

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Bibliographische Detailangaben
Hauptverfasser:	LIM, YONG GYU, LEE, HEOK JAE, YANG, YUN SIK, CHO, JUNG HUN, CHO, SE HWI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	An apparatus and a method for depositing a thin film are provide to obtain a thin film having a uniform thickness by preventing impurities from being formed in a nozzle tube that supplies processing gas. An apparatus for depositing a thin film comprises a chamber(10) having an internal space defined by a substrate holder(40) and an inner wall of the chamber, and a nozzle tube(30). The nozzle tube includes a first end portion(31) fixed to the inner wall of the chamber, a second end portion(32) extending toward the internal space of the chamber, a fluid path(33) extending through the first end portion to the second end portion of the nozzle tube, and at least one slit(34) formed in the second end portion of the nozzle tube to open the fluid path. The nozzle tube includes a long nozzle tube and a short nozzle tube shorter.