LOW TEMPERATURE AEROSOL DEPOSITION OF A PLASMA RESISTIVE LAYER

LOW TEMPERATURE AEROSOL DEPOSITION OF A PLASMA RESISTIVE LAYER

A method of low temperature aerosol deposition of a plasma resistive layer is provided to protect chamber components from corrosive plasma environment and increase lifespan of the chamber components by depositing a plasma resistive layer on the chamber components at a stable low temperature. A metho...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KATS SEMYON L, RYABOVA ELMIRA, THACH SENH, ZHU XI, SUN JENNIFER Y
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method of low temperature aerosol deposition of a plasma resistive layer is provided to protect chamber components from corrosive plasma environment and increase lifespan of the chamber components by depositing a plasma resistive layer on the chamber components at a stable low temperature. A method of low temperature aerosol deposition of a plasma resistive layer for semiconductor chamber components, the method comprises the steps of: forming an aerosol comprising fine particles in an aerosol generator(100); distributing the aerosol from the aerosol generator to a processing chamber(122), toward a surface(140) of a substrate(132); maintaining a temperature of the substrate at between about 0.C and 50.C and depositing a layer made of the aerosol material on the surface of the substrate.