DOUBLE-SIDED FLEXIBLE COPPER-CLAD LAMINATED SUBSTRATE AND METHOD OF PRODUCING DOUBLE-SIDED FLEXIBLE COPPER-CLAD LAMINATED SUBSTRATE WITH CARRIER

A double-sided flexible copper-clad laminated substrate and a method for manufacturing the double-sided flexible copper-clad laminated substrate attached with a carrier are provided to repress wrinkles on a thin copper foil and to separate the thin copper foil and the carrier easily by forming a release layer. A method for manufacturing a double-sided flexible copper-clad laminated substrate(6) having thin copper foils(2) on both surfaces by separating a carrier(4) from the thin copper foil attached with the carrier by a release layer(3) comprises the step of: forming a one-sided flexible copper-clad laminated substrate attached with the carrier by forming a polyimide resin layer(1) on the surface of the thin copper foil attached with the carrier; annealing the other thin copper foil attached with the carrier; forming the double-sided flexible copper-clad laminated substrate attached with the carrier by laminating the annealed thin copper foil attached with the carrier, on the surface of the polyimide resin layer of the one-sided flexible copper-clad laminated substrate attached with the carrier, while the carrier faces outward; and forming the double-sided flexible copper-clad laminated substrate by separating the carrier from the double-sided flexible copper-clad laminated substrate attached with the carrier.