ELECTRONIC DEVICE

An electronic device is provided to efficiently contact a ground plate on a front surface of a case in spite of coating the front surface of the case. An electronic device includes a main chassis(10), a front circuit board(20), and a ground plate(30). A hole is formed on a front surface of the main...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	CHUNG, JAE PHIL
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An electronic device is provided to efficiently contact a ground plate on a front surface of a case in spite of coating the front surface of the case. An electronic device includes a main chassis(10), a front circuit board(20), and a ground plate(30). A hole is formed on a front surface of the main chassis. The front circuit board is coupled with a front of the main chassis. The ground plate is in contact with the front circuit board through the hole. EMI(ElectroMagnetic Interference) generated inside the main chassis is spread through the ground plate and the front circuit board. A suspending unit is formed at the ground plate to suspend the ground plate on a front inner surface of the main chassis when the ground plate passes through the hole. A fixing unit is formed at the ground plate to suspend the ground plate on a front outer surface of the main chassis when the ground plate passes through the hole.