FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE FILM CARRIER TAPE

A film carrier tape for mounting electronic components and a method for manufacturing the same are provided to form a wiring having a fine pitch without increasing a cost by using a flexible conducting foil laminate as a wiring material. A film carrier tape is formed by using a flexible conducting f...

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Bibliographische Detailangaben
Hauptverfasser:	YASUI NAOYA, KURIHARA HIROAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A film carrier tape for mounting electronic components and a method for manufacturing the same are provided to form a wiring having a fine pitch without increasing a cost by using a flexible conducting foil laminate as a wiring material. A film carrier tape is formed by using a flexible conducting foil laminate including a conducting foil and a base film. A roughness of a surface of the conductor foil bonded to the base film is 2.5 micrometers or less. A roughness of a resist surface of the conductor foil is 1.0 micrometer or less. A glossiness[Gs(60degrees)] of the resist surface of the conductor foil is 400 or more. The flexible conducting foil laminate is a flexible copper laminate including a surface-processed electrolytic copper foil and the base film.