PROBE TIP AND MANUFACTURING METHOD

PROBE TIP AND MANUFACTURING METHOD

A probe tip and a manufacturing method thereof are provided to prevent the other part except for the probe tip from being contacted, in contacting the probe tip with a chip pad and to separate the probe tip formed in a hole, after electro-plating. A probe tip(100) contacts with a pad of an IC(Integr...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: KIM, YONG WHAN
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
SEMICONDUCTOR DEVICES
TESTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A probe tip and a manufacturing method thereof are provided to prevent the other part except for the probe tip from being contacted, in contacting the probe tip with a chip pad and to separate the probe tip formed in a hole, after electro-plating. A probe tip(100) contacts with a pad of an IC(Integrated Circuit) to detect an electric signal of the IC. The probe tip is composed of a support unit(110) having a trapezoid-shaped longitudinal section and a needle unit(120) formed from the upper end of the sport unit in a vertical direction. A longitudinal section of the upper front end of the needle unit has a trapezoid shape. The height of the probe tip is 50 to 100 um.