BURN-IN SOCKETS FOR BGA IC DEVICES HAVING AN INTEGRATED SLIDER WITH FULL BALL GRID COMPATIBILITY

A burn-in socket for a BGA(Ball Grid Array) IC(Integrated Circuit) device having an integrated slider with full ball grid capability is provided to have an integrated type array and anti-stick characterizing member for receiving IC device packages with different sizes. A slider(24) has an upper wall surface including plural holes with a grid array formed by crossed ribs. Plural extension wall members are extended upwardly from a portion of x-direction rib and play a role of a precise array characterizing portion. An IC device is located at the upper flat portion between rows of solder ball terminals of the IC device. An anti-sticking finger(24c) is extended from an extension wall portion(24b) toward x-direction along a y-direction rib for forming the outside limitation of the first row of the main grid hole. A concave surface(24d) is arranged at each finger and contacted with the extension wall surface. The height of the extension wall surface is limited below at the position of the solder ball of the IC device so that the clearance for the mechanical support ball is offered.