COVERLAY

A coverlay is provided to improve dimensional stability and heat resistance and to enhance the application to a flexible printed circuit board using lead-free welding method. A coverlay comprises a polyimide film which comprises 10-50 mol% of p-phenylene diamine and 60-90 mol% of 4,4'-diaminodi...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SAWASAKI KOICHI, MAEDA MEGURU, OGUNI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP
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Beschreibung
Zusammenfassung:	A coverlay is provided to improve dimensional stability and heat resistance and to enhance the application to a flexible printed circuit board using lead-free welding method. A coverlay comprises a polyimide film which comprises 10-50 mol% of p-phenylene diamine and 60-90 mol% of 4,4'-diaminodiphenyl ether as a diamine component and 50-99 mol% of pyromellitic dianhydride and 1-50 mol% of 3,3',4,4'-biphenyl tetracarboxylic dianhydride as an acid dianhydride component; and an adhesive layer which is formed on the one side of the polyimide film. Preferably the adhesive comprises at least one selected from an epoxy resin, an acrylic resin and a polyimide resin.