STACK TYPE WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND WAFER LEVEL STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

A stack-type wafer level package, a manufacturing method thereof, and a wafer level stack package and a manufacturing method thereof are provided to improve the productivity and reliability by protruding a penetrating electrode through a single process. A through-hole is formed in a semiconductor ch...

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Bibliographische Detailangaben

1. Verfasser:	MA, KEUM HEE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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