METHOD OF FORMING SEMICONDUCTOR DEVICE HAVING A WIRING

A method for forming a semiconductor device having a wiring is provided to minimize voids within an opening by filling the opening with a metal layer. An insulating layer having an opening(16a) is formed on a semiconductor substrate(10). A first barrier layer(18) is conformally formed within the ope...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHEONG, SEONG HWEE, PARK, JIN HO, LEE, SANG WOO, YANG, SEUNG GIL, LEE, BRAD H
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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