SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR FORMING THE SAME
A semiconductor memory device and a fabricating method thereof are provided to improve the reliability of the semiconductor device by preventing short circuit between a metal contact and other metallization. A first insulating layer is formed on a semiconductor substrate(100) having a conductive reg...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | A semiconductor memory device and a fabricating method thereof are provided to improve the reliability of the semiconductor device by preventing short circuit between a metal contact and other metallization. A first insulating layer is formed on a semiconductor substrate(100) having a conductive region. A storage node pad(350) is formed on the first insulating layer, and is electrically connected to the semiconductor substrate. A contact pad(380) is formed on the first insulating layer, and is spaced apart from the storage node pad. A capacitor(500) is connected to the storage node pad. The capacitor has a bottom electrode(520) formed on the storage node pad, a dielectric layer(540) formed on the bottom electrode, and a top electrode(560) formed on the dielectric layer. |
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