TRANSFER METHOD FOR SEMICONDUCTOR PACKAGE OF SAWING SORTER SYSTEM

A transfer method for a semiconductor package of a sawing sorter system is provided to load the semiconductor package even during the cut, store, transfer, test and sorting processes about the package, thereby overcoming the congestion completely. A sawing sorter system comprises a supply part(100),...

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Bibliographische Detailangaben

Hauptverfasser:	HAN, CHUNG HEE, HAN, BYONG HO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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