TRANSFER METHOD FOR SEMICONDUCTOR PACKAGE OF SAWING SORTER SYSTEM

A transfer method for a semiconductor package of a sawing sorter system is provided to load the semiconductor package even during the cut, store, transfer, test and sorting processes about the package, thereby overcoming the congestion completely. A sawing sorter system comprises a supply part(100), a test part(200) and a storage part(300). A first table(110) and a second table(120) included in the supply part are located adjacent to each other in a cross direction, and installed on transfer rails(111,121) respectively. A picker device(400) to pick up a semiconductor package(PKG) is installed on the transfer rails. The picker device respectively picks up and loads the package in a tray if the test is completed respectively. The test part judges the conformity and the unconformity of the package by performing various tests.