THE PROBE NEEDLE ABRASIVE SHEET FOR EXAMINATION TO SEMICONDUCTOR

A polishing sheet of a probe needle for inspecting a semiconductor is provided to extend the lifetime of a probe needle by removing the foreign substances attached to the probe needle while sharpening the end of the probe needle. A releasable film(10) of a thin film type is formed in the bottommost part of a polishing sheet of a probe needle for inspecting a semiconductor. A polyimide film(20) having silicon adhesive(20a) on its bottom surface is formed on the releasable film. A silicon adhesive primer layer(30) having a thickness of 10-100 micrometers is formed on the polyimide film. A silicon polishing sheet(40) is formed on the primer layer, composed of vinyl terminated dimethyl polysiloxane, silicon carbide, a platinum compound, methyl hydrogen polysiloxane and pigment. A releasable film(50) of a thin film type is stacked as a shape of a circular sheet in the uppermost part of the polishing sheet.