COPPER ETCHANT AND METHOD OF ETCHING

It is intended to perform selective uniform etching of copper or a copper alloy even when mixed with another metal. There is provided a copper etchant of

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Bibliographische Detailangaben
Hauptverfasser:	AOKI MASUMI, ISHIKAWA MAKOTO, SAITOU NORIYUKI, KATSUKI TAKANOBU
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLICMATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASSC23 AND AT LEAST ONEPROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25 NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE
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Beschreibung
Zusammenfassung:	It is intended to perform selective uniform etching of copper or a copper alloy even when mixed with another metal. There is provided a copper etchant of