THICK FILM CONDUCTOR COMPOSITIONS AND THE USE THEREOF IN LTCC CIRCUITS AND DEVICES

A thick film composition is provided to ensure excellent re-firing stability, and be used as a dielectric or insulating material together with low-temperature co-fired ceramic materials and various other paste components to form multi-layered electronic circuits. A low-temperature co-fired ceramic circuit includes a thick film composition, wherein the thick film composition is treated to sinter glass frit(s), metal powder, and other sintering aids and remove an organic medium. The thick film composition comprises, based on a total weight percent of the thick film composition, (a) 30-98wt% of fine particles selected from precious metals, alloys of precious metals, and mixtures thereof, (b) at least one inorganic binder, and (c) an organic medium in which the components (a) and (b) are dispersed, wherein the at least one inorganic binder(b) is selected from (1) 0.2-20wt% of at least one fire-resistant glass composition having a specific viscosity(log n) of 6-7.6 at the firing temperature of the low-temperature co-fired ceramic circuit, (2) 0.1-5wt% of an additional inorganic binder selected from (i) metal oxides, (ii) metal oxide precursors, (iii) non-oxide borides, (iv) non-oxide silicides, and (v) mixtures thereof. The glass composition is immiscible or partially miscible with remaining glasses present on the low temperature co-fired ceramic substrate glass in the firing condition.