REDUCED OXIDATION SYSTEM FOR WIRE BONDING

A reduced oxidation system for wire bonding is provided to reduce potential oxidation of a wire during a wire bonding process by supplying a predetermined quantity of gas to a bond site area. A semiconductor device is held by a bond site area while a wire bonding process is performed. A gas is suppl...

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Bibliographische Detailangaben
Hauptverfasser:	GILLOTTI GARY, MAK STEVEN, FRASCH E. WALTER
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A reduced oxidation system for wire bonding is provided to reduce potential oxidation of a wire during a wire bonding process by supplying a predetermined quantity of gas to a bond site area. A semiconductor device is held by a bond site area while a wire bonding process is performed. A gas is supplied from a position above the bond site area to the bond site area by a gas supply line. The gas supply line can include a tube having an outlet hole confronting the bond site area. The tube can include a bond head(10).