PHOTO-SENSITIVE RESIN COMPOSITION CONTAINING INORGANIC PARTICLE, PHOTO-SENSITIVE FILM, AND PROCESS OF FORMING INORGANIC PATTERN

A photosensitive resin composition containing an inorganic particle for forming a display member, a photosensitive film prepared by using the composition, a method for forming an inorganic pattern by using the composition, and a method for preparing a flat panel display by the method are provided to improve the precision of pattern and the thermal decomposition of an organic component and to reduce the contraction after sintering. A photosensitive resin composition comprises an inorganic particle; an alkali-soluble resin; a radiation curing agent having at least two (meth)acryloyl groups and at least one bond selected from an acetal bond, a hemiacetal ester bond and a monothioacetal bond; and a photopolymerization initiator. Preferably the radiation curing agent has at least one group selected from the groups represented by the formula 1 or 2, wherein R1 and R4 are H or a methyl group; R2 and R5 are an organic residue; R3 and R6 are H or an organic residue; and * represents the position bonded to a molecular frame.