COATING COMPOSITION FOR STACKED CHIP TYPE ELECTRONIC DEVICE, STACKED CHIP TYPE ELECTRONIC DEVICE AND FABRICATION METHOD THEREOF USING THE SAME

A surface coating composition for a stacked chip type electronic device, the stacked chip type electronic device using the same and a manufacturing method thereof are provided to improve productivity and a manufacturing cost by shortening a manufacturing process of a staked chip type electronic devi...

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Bibliographische Detailangaben
Hauptverfasser:	CHOI, HUN GUE, KWON, O CHUNG, LEE, HEE KOUN, KWON, TAI YOUNG
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS CORRECTING FLUIDS DYES ELECTRICITY FILLING PASTES INDUCTANCES INKS MAGNETS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES RESISTORS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS USE OF MATERIALS THEREFOR WOODSTAINS
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Beschreibung
Zusammenfassung:	A surface coating composition for a stacked chip type electronic device, the stacked chip type electronic device using the same and a manufacturing method thereof are provided to improve productivity and a manufacturing cost by shortening a manufacturing process of a staked chip type electronic device. A stacked chip type electronic device using a surface coating composition includes a stacked chip type electronic device body(110), at least one internal electrode (115), a coating layer(120), and an outer electrode(130). The stacked chip type electronic device body(110) is formed as a predetermined shape by stacking a plurality of unit layers. At least one internal electrode(115) is installed in the main body of the electronic device(110). The coating layer(120) which is composed of a mixture of a crystal glass powder and an amorphous glass powder is formed on the surface of the main body of the electronic device(110). The outer electrode(130) is formed on at least part of the surface of the main body of the electronic device(110).