ELECTROPLATING PLATING-FORM FIXATION ELECTRIC CURRENT DISPERSION METHOD

A current dispersing method of a plating object-fixing device during electroplating is provided to prevent the generation of defective products, reduce the manufacturing cost, and improve production efficiency by flowing an uniform and stable electric current to a plurality of plating objects fixed to the plating object-fixing device, thereby forming a plating layer with a constant thickness on the plating objects. In an electroplating method forming a thin film of the other metal on a surface of a metal using a principal of electrolysis, a current dispersing method of a plating object-fixing device during electroplating comprises: installing a plating object-fixing device(10) including a plurality of plating object-fixing pins(40) fixed to one side of a supporting frame(30) to stack and fix plating objects(60) to be plated in multistage, a grounding plate(20) formed in an upper part of the supporting frame together with a grounding part(70) such that an electric current can flow to the grounding plate, a movement handle(50) fixed to the grounding plate, and one or more of current dispersing guides(90) made of a metal material and fixed to one side of the supporting frame; and performing electroplating while transmitting an electric current to the plating object-fixing device such that the electric current is transmitted vertically and uniformly as a whole.