FABRICATION OF A FERROMAGNETIC INDUCTOR CORE AND CAPACITOR ELECTRODE IN A SINGLE PHOTO MASK STEP
An integrated circuit capacitor having a bottom plate (50a), a dielectric layer (250'), and a ferromagnetic top plate (20a). Also, a method of manufacturing an integrated circuit on a semiconductor wafer. The method comprising forming a bottom plate of a capacitor (50a) and a bottom portion of...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | An integrated circuit capacitor having a bottom plate (50a), a dielectric layer (250'), and a ferromagnetic top plate (20a). Also, a method of manufacturing an integrated circuit on a semiconductor wafer. The method comprising forming a bottom plate of a capacitor (50a) and a bottom portion of an induction coil (50a), forming an etch stop layer (250'), forming a ferromagnetic capacitor top plate (20a) and a ferromagnetic core (20b), forming a top portion of the induction coil (50b) plus vias (50c) that couple the top portion of the induction coil (50b) to the bottom portion of the induction coil (50c). |
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