SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

An epoxy resin composition for encapsulating a semiconductor, and a semiconductor device encapsulated with the composition are provided to lower the coefficient of linear expansion in case of soldering, to increase Tg and to improve heat resistance. An epoxy resin composition comprises an epoxy resi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIMURA YASUO, ASANO EIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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