SEMICONDUCTOR ENCAPSULATING EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

An epoxy resin composition for encapsulating a semiconductor, and a semiconductor device encapsulated with the composition are provided to lower the coefficient of linear expansion in case of soldering, to increase Tg and to improve heat resistance. An epoxy resin composition comprises an epoxy resi...

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Bibliographische Detailangaben
Hauptverfasser:	KIMURA YASUO, ASANO EIICHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	An epoxy resin composition for encapsulating a semiconductor, and a semiconductor device encapsulated with the composition are provided to lower the coefficient of linear expansion in case of soldering, to increase Tg and to improve heat resistance. An epoxy resin composition comprises an epoxy resin which comprises an epoxy resin represented by the formula 1 and an epoxy resin represented by the formula 2; a phenolic resin curing agent having at least one substituted or unsubstituted naphthalene ring at a molecule; and an inorganic filler. In the formulae, m and n are 0 or 1; R is H, a C1-C4 alkyl group or a phenyl group; G is a glycidyl-containing organic group; R1 is H, a C1-C4 alkyl group or a phenyl group; and p is an integer of 0-10.