TEST METHOD FOR SEMICONDUCTOR CHIP PACKAGE

A semiconductor chip package test method is provided to improve test reliability by judging whether a test program is proper or not for every semiconductor chip package. A semiconductor chip package test method is composed of steps for inputting essential information including semiconductor chip package related information including a lot ID(Identification) and test environment related information(51); searching reference information corresponding to the essential information, in a database of a server storing the reference information, wherein the reference information is a standard for searching a test program proper for the semiconductor chip package according to the essential information(52); searching the test program proper to the reference information from the program database of the server storing the test programs(53); checking whether a previous test program stored in a storing unit and the searched test program are same or not(54); judging whether the stored test program is proper to the semiconductor chip package or not, if the previous test program and the searched test program are same(55); and processing a test of the semiconductor chip package by the stored test program if the stored test program is proper and storing the executed test program in the storing unit(57).