CHEMICAL MECHANICAL POLISHING SYSTEM

CHEMICAL MECHANICAL POLISHING SYSTEM

A CMP system is provided to eliminate the necessity for installing a dummy wafer station in a position except a wafer cassette loading/unloading part. A wafer is chemically and mechanically polished by a polishing part(500). The wafer is cleaned by a cleaning part(300). A factory interface robot(200...

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Bibliographische Detailangaben
Hauptverfasser: PARK, MI SEOK, KWON, YOUNG MIN, CHO, JUNG HYUN, SUNG, SOON HWAN, PARK, JUN HO, KIM, HAE CHUL
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A CMP system is provided to eliminate the necessity for installing a dummy wafer station in a position except a wafer cassette loading/unloading part. A wafer is chemically and mechanically polished by a polishing part(500). The wafer is cleaned by a cleaning part(300). A factory interface robot(200) transfers the wafer between a wafer cassette loading/unloading part(100) and the cleaning part. A dummy wafer is stored in a dummy wafer station adjacent to the factory interface robot. A wet robot(400) transfers the wafer between the polishing part and the cleaning part.