DIE ATTACH FILM HAVING FILLER LAYER AND CHIP STACK PACKAGE USING THEREOF

A die attach film including a filler layer is provided to prevent a signal transmission fail by attaching an upper semiconductor chip to the upper surface of a lower semiconductor chip wherein a die attach film including a filler layer is attached to the upper semiconductor chip. A filler layer(40) is made of a filler(41) attached to a circuit pattern formation surface of a semiconductor chip(50,55). An adhesive layer(30) is attached to the lower surface of the filler layer. A die attach film is composed of the filler layer and the adhesive layer. The filler can be a non-conductive material.