SEMICONDUCTOR FRAME HAVING RESIN MOLDING PORTION PROTRUDED

A semiconductor substrate having a protruded resin molding portion is provided to distribute the stress concentrated on the circumference of the edge of a resin molding portion by a difference of a thermal expansion coefficient between a resin molding portion and a printed circuit board by forming a...

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Bibliographische Detailangaben
Hauptverfasser:	SIN, WHA SU, LEE, JAE HYUK
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A semiconductor substrate having a protruded resin molding portion is provided to distribute the stress concentrated on the circumference of the edge of a resin molding portion by a difference of a thermal expansion coefficient between a resin molding portion and a printed circuit board by forming a protrusion portion on the circumference of the edge of the upper surface of the resin molding portion encapsulating the upper part of the printed circuit board. A semiconductor frame(10) includes a printed circuit board(20), at least one semiconductor chip(30) mounted on the printed circuit board, and a resin molding portion including the semiconductor chip and the upper part of the printed circuit board. A protrusion portion(41) is formed on the circumference of the edge of the upper surface(21) of the resin molding portion. A part or all of the semiconductor chip mounted on the printed circuit board can be molded by the resin molding portion.