DIRECT BONDED CHIP SCALE PACKAGED LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF
A chip scale packaged light emitting diode and its fabricating method are provided to obtain two individual light emitting elements by connecting an n type first electrode with an n type second electrode and separating chips from each other. A chip scale packaged light emitting diode includes a subs...
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| creator | KIM, SANG MOOK LEE, JIN HONG KIM, KANG HO OH, HWA SEOP BAEK, JONG HYEOB LEE, SEUNG JAE JEONG, TAK YOM, HONG SEO YU, YOUNG MOON KIM, YOON SEOK JHIN, JUNG GUN LEE, SANG HERN |
| description | A chip scale packaged light emitting diode and its fabricating method are provided to obtain two individual light emitting elements by connecting an n type first electrode with an n type second electrode and separating chips from each other. A chip scale packaged light emitting diode includes a substrate(200) and n type and p type semiconductor layers(201,203) formed on the substrate. An n type first electrode(205) and a p type first electrode(204) are formed on the n type semiconductor layer and the p type semiconductor layer, respectively. A first protective layer is formed on the n type first electrode and the p type first electrode. An n type second electrode(210) and a p type second electrode(209) are electrically connected through the first protective layer to the n type first electrode and the p type first electrode. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DIRECT BONDED CHIP SCALE PACKAGED LIGHT EMITTING DIODE AND FABRICATION METHOD THEREOF |
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