FLEXIBLE METAL CLAD LAMINATE AND METHOD FOR MANUFACTURING THE SAME

A flexible metal clad substrate and a manufacturing method thereof are provided to maintain a constant physical property of the flexible metal clad substrate for a long time and increase a strength of a metal conductive layer by controlling metal ions. A flexible metal clad substrate includes a poly...

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Bibliographische Detailangaben
Hauptverfasser:	KIM, KYUNG KAK, KIM, PAN SEOK, AN, JOONG KYU, JUN, SANG HYUN
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A flexible metal clad substrate and a manufacturing method thereof are provided to maintain a constant physical property of the flexible metal clad substrate for a long time and increase a strength of a metal conductive layer by controlling metal ions. A flexible metal clad substrate includes a polymer film(100), a hetero metal layer(110), a metal seed layer(120), and a metal conductive layer(130). A composition ratio of a (111) plane of the metal conductive layer that is I(111)/I all is between 0.5 and 0.65. A composition ratio of a (200) plane of the metal conductive layer that is I(200)/I all is greater than 0.15. The hetero metal layer is made of Ni, Cr, or an alloy thereof. The metal seed layer and the metal conductive layer are made of copper or a copper alloy.