CLEANING FORMULAT1ONS

Cleaning formulations are provided to remove residues from a semiconductor substrate by using a composition including a water-miscible organic solvent, a buffering agent, and a corrosion inhibitor. A composition for removing residues from a semiconductor substrate includes water, one or more compound of a chemical formula, a fluoride ion source, a water-miscible organic solvent, a buffering agent, and a corrosion inhibitor. The water is 10.0 to 90.0 weight percent. The compound of the chemical formula is 2.0 to 75.0 weight percent. The fluoride ion source is 0.1 to 5.0 weight percent. The water-miscible organic solvent is 10.0 to 75.0 weight percent. The buffering agent is 0.2 to 30.0 weight percent. The corrosion inhibitor is 0.01 to 5.0 weight percent. The compound of the chemical formula is selected from a group including 1,1-dimethylurea, 1,3-dimethylurea, 1,1,3-trimethylurea, 1,1,3,3-tetramethylurea, 1,3-bis(2-hydroxyethyl) urea, 1-methyl, 3-(2-hydroxypropyl) urea, and mixtures thereof.