SUBSTRATE PROCESSING APPARATUS

A substrate processing apparatus is provided to treat uniformly a process solution on the surface of a substrate by forming a liquid layer on the surface of the substrate and changing slantly the position of the substrate using a liquid layer forming unit and a position changing unit. A substrate pr...

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Bibliographische Detailangaben
1. Verfasser: YOSHITANI MITSUAKI
Format: Patent
Sprache:eng
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Zusammenfassung:A substrate processing apparatus is provided to treat uniformly a process solution on the surface of a substrate by forming a liquid layer on the surface of the substrate and changing slantly the position of the substrate using a liquid layer forming unit and a position changing unit. A substrate processing apparatus includes a first transfer unit for transferring horizontally a substrate, a liquid layer forming unit, a position changing unit, and an additional supply unit. The liquid layer forming unit is used for forming a liquid layer on the entire surface of the substrate by supplying a first process solution on the substrate. The position changing unit(48) is used for changing slantly the position of the substrate. The additional supply unit is used for supplying additionally the first process solution onto the uppermost portion of the substrate.