CHIP ON FILM
A chip on film is provided to enhance the flexibility of the film by using a polyimide film having high dimension stability and desired elastic modulus. A chip on film includes a polyimide film(1) and a wiring(2) formed on at least one surface of the polyimide film, on which an integrated chip is mo...
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| Format: | Patent |
| Sprache: | eng |
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| Zusammenfassung: | A chip on film is provided to enhance the flexibility of the film by using a polyimide film having high dimension stability and desired elastic modulus. A chip on film includes a polyimide film(1) and a wiring(2) formed on at least one surface of the polyimide film, on which an integrated chip is mounted. The polyimide film includes para-phenylenediamine and 4,4'-diamino diphenyl ether as a diamine component, and pyromellitic dianhydride and 3,3',4,4'-biphenylyl tetra carboxylate dianhydride as an acid dianhydride component. The wiring is formed on the polyimide film with no adhesive. |
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