LEAD-FREE SOLDER, SOLDER JOINT PRODUCT AND ELECTRONIC COMPONENT

A lead-free solder, which has excellent oxidation resistance, mechanical properties, and plastic workability, can be molded into a ribbon or a filament, and can secure satisfactory solder bonding strength and reliability, and a highly reliable solder joint product formed by jointing with the lead-fr...

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Bibliographische Detailangaben
Hauptverfasser:	HISAZATO YUUJI, THANTRONG LONG
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A lead-free solder, which has excellent oxidation resistance, mechanical properties, and plastic workability, can be molded into a ribbon or a filament, and can secure satisfactory solder bonding strength and reliability, and a highly reliable solder joint product formed by jointing with the lead-free solder, and an electronic component are provided. A lead-free solder comprises a tin (Sn)-based alloy having a tantalum(Ta) content of 0.005 to 2.0 wt.%. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta) and 0.1 to 10.0 wt.% of zinc(Zn) with the balance of tin(Sn) and unavoidable impurities. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta) and 0.1 to 60.0 wt.% of bismuth(Bi) with the balance of tin(Sn) and unavoidable impurities. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta) and 0.1 to 10.0 wt.% of indium(In) with the balance of tin(Sn) and unavoidable impurities. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta) and 0.01 to 7.5 wt.% of copper(Cu) with the balance of tin(Sn) and unavoidable impurities. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta) and 0.01 to 5.0 wt.% of silver(Ag) with the balance of tin(Sn) and unavoidable impurities. A lead-free solder comprises a tin(Sn)-based alloy comprising 0.005 to 2.0 wt.% of tantalum(Ta), 0.01 to 5.0 wt.% of silver(Ag) and 0.01 to 7.5 wt.% of copper(Cu) with the balance of tin(Sn) and unavoidable impurities.