LASER CUTTING APPARATUS

A laser cutting apparatus that can improve the cutting quality of substrates is provided. A laser cutting apparatus for cutting a substrate with brittleness such as glass comprises: a scriber(78) for forming a predetermined fine crack on the substrate, a laser generation unit(7) for forming a laser, a laser transmission distance control system(75) disposed on a laser transmission line to control a transmission distance of the laser, a laser system for heating and expanding the substrate along the fine crack, and a cooling system(79) for cooling the heated and expanded substrate. The laser system comprises: a condensing lens(77) for condensing lasers to irradiate the condensed lasers onto the substrate, a laser cutoff system(72) installed next to the laser generation unit to cut off or pass the laser, and a collimator(74) for converting lasers into parallel lasers to project the parallel lasers to the condensing lens.